{"title":"Dongxing Wang","description":null,"products":[{"product_id":"information-science-and-electronic-engineering-taylor-francis-ltd-9781138029873-proceedings-of-the-3rd-international-conference-of-electronic-engineering-and-information-science-iceeis-2016-january-4-5-2016-harbin-china-dongxing-wang","title":"Information Science and Electronic Engineering","description":"\u003cp\u003eDiscover the fascinating world of technology with \"Information Science and Electronic Engineering\" by Dongxing Wang, published by Taylor \u0026amp; Francis Ltd in 2016. This comprehensive hardback edition spans 462 pages and delves into the essential topics discussed at the 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016), held in Harbin, P.R. China. Sponsored by Harbin University of Science and Technology, the conference brought together experts to explore cutting-edge subjects such as semiconductor materials, nano materials, mechanical materials, MEMS materials, and the intersection of electronic engineering with information science. This book is an invaluable resource for students, professionals, and researchers looking to deepen their understanding of these critical fields. Enhance your knowledge and stay updated on the latest advancements in information science and electronic engineering today!\u003c\/p\u003e","brand":"Dongxing Wang","offers":[{"title":"Default Title","offer_id":52239442084182,"sku":"9781138029873","price":242.5,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781138029873.jpg?v=1767761715"},{"product_id":"electronic-engineering-taylor-francis-ltd-9781138602601-proceedings-of-the-4th-international-conference-of-electronic-engineering-and-information-science-iceeis-2017-january-7-8-2017-haikou-p-r-china-dongxing-wang","title":"Electronic Engineering","description":"\u003cp\u003eExplore the cutting-edge world of electronic engineering with \"Electronic Engineering\" by Dongxing Wang, published by Taylor \u0026amp; Francis Ltd in 2018. This comprehensive hardback edition spans 254 pages and serves as a vital resource for professionals and enthusiasts alike. The book encapsulates insights from the ICEEIS 2017 conference, where world-class researchers, engineers, and educators converged to share their latest advancements in electronic engineering and information science. Whether you are looking to deepen your understanding of the field or stay updated with the latest trends and technologies, this book is an essential addition to your library. Discover the innovations that are shaping the future of electronics and enhance your expertise with this informative guide.\u003c\/p\u003e","brand":"Dongxing Wang","offers":[{"title":"Default Title","offer_id":52245068382550,"sku":"9781138602601","price":266.75,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9781138602601.jpg?v=1767769077"},{"product_id":"electronic-engineering-and-information-science-taylor-francis-ltd-9781138027725-proceedings-of-the-international-conference-of-electronic-engineering-and-information-science-2015-iceeis-2015-january-17-18-2015-harbin-china-dongxing-wang","title":"Electronic Engineering and Information Science","description":"\u003cp\u003eThe International Conference of Electronic Engineering and Information Science 2015 (ICEEIS 2015) was held on January 17-18, 2015, Harbin, China. 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