CMOS Plasma and Process Damage

Explore the intricate world of semiconductor manufacturing with CMOS Plasma and Process Damage, a comprehensive guide authored by leading experts in the field. Published by Springer International Publishing AG in 2025, this hardback edition spans an impressive 466 pages and delves into the critical issues of plasma and process damage that occur during high-energy chip manufacturing processes.

This essential resource provides readers with a detailed understanding of how these damaging effects can lead to functional failures and reliability challenges in chips. Whether you are a student, researcher, or industry professional, this book equips you with the knowledge to navigate the complexities of semiconductor technology and improve manufacturing practices. Don’t miss the opportunity to enhance your expertise in this vital area of electronics.