Hybrid Assemblies and Multichip Modules

Discover the essential guide to hybrid assemblies and multichip modules with Hybrid Assemblies and Multichip Modules by Taylor & Francis Inc. Published in 1992, this comprehensive hardback spans 296 pages and serves as an invaluable resource for engineers and designers alike. This book offers a detailed exploration of design considerations from the user's perspective, focusing on the materials used in the manufacturing of hybrid assemblies and multichip modules. With insightful discussions on substrate materials and metals utilized for conductors, this reference illustrates the creation of these innovative products for a wide range of applications. Whether you're a seasoned professional or a newcomer to the field, this book will enhance your understanding and expertise in the world of hybrid technology.