ISTFA 2021

Discover the latest advancements in microelectronics with ISTFA 2021, published by ASM International in 2022. This comprehensive paperback, spanning 461 pages, delves into the theme of System-in-Package (SiP) technology, showcasing cutting-edge research and discussions from industry experts.

The conference proceedings cover a wide array of essential topics, including board and system-level failure analysis, strategies for detecting counterfeit microelectronics, and innovative failure analysis techniques. Additionally, the book addresses future challenges in the field and explores the applications of scanning probe analysis.

Whether you are a professional in the electronics industry, a researcher, or an academic, ISTFA 2021 is an invaluable resource that provides insights into the evolving landscape of failure analysis and the technologies shaping the future. Enhance your knowledge and stay ahead in this critical area of study!